Product introduction:

Nitrogen trifluoride (NF3) is a colorless, odorless, stable gas and a strong oxidant. Nitrogen trifluoride has a melting point of - 206.8 ℃ and a boiling point of - 129.0 ℃, and is insoluble in water. As an excellent plasma etching gas in the microelectronics industry, nitrogen trifluoride is decomposed into active fluorine ions during plasma etching. When etching silicon and silicon nitride, nitrogen trifluoride has a higher etching rate and selectivity than carbon tetrafluoride and the mixture of carbon tetrafluoride and oxygen, especially when the thickness is less than 1.5 μ In the etching of m's integrated circuit materials, nitrogen trifluoride has excellent etching rate and selectivity, leaving no residue on the surface of the etched object, and is also a very good cleaning agent.

Product index:

Product use:

Nitrogen trifluoride can be used as a fluorine source for high-energy chemical laser gas, and also as an etchant for semiconductor materials such as polysilicon, silicon nitride, tungsten silicide, etc. It can also be used as cleaning agent for chemical vapor deposition chamber and LCD panel of semiconductor chip production. Using nitrogen trifluoride as cleaning agent for CVD box can reduce pollutant emissions by about 90% compared with perfluorocarbons, and significantly improve cleaning speed and cleaning capacity.

Packaging and storage:

Nitrogen trifluoride is filled in seamless steel cylinders with the volume of 8L, 40L, 43.3L and 47L respectively; The cylinder pressure is 9.0-13.0MPa. The specific packaging specifications can be customized and changed according to user needs.